How IEEE 370 was developed
Common industry problems and how IEEE 370 tackles them
An overview of the IEEE 370 toolset (“Briefcase”) based on open-source software development
- Live Q&A
Xiaoning Ye: IEEE 370 Development: Key to a Successful De-Embedding
Heidi Barnes: Test Fixture Design Criteria
Jay Diepenbrock: De-Embedding Verification
Mikheil Tsiklauri: S-Parameter Integrity
Se-Jung Moon: IEEE 370 Briefcase
The IEEE 370 Overview: A Robust Framework for Interconnect Characterization - Live Virtual Training
live virtual training overview
IEEE 370™-2020, Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz, sponsored by IEEE EMC Society, was officially published on 8 January 2021. It provides standard and recommended practices for ensuring the quality of measured data for high-frequency electrical interconnect at frequencies up to 50 GHz. This might include, but is not limited to, recommending design of test fixtures, as well as methods and processes for ensuring the accuracy and consistency of measured data. Although the methods and techniques contained in the standard have been validated only to 50 GHz, the standard and general practice should be applicable for frequencies higher than 50 GHz as well.
Below is a snapshot of how IEEE 370 addresses the common industry problem of low quality S parameters:
This workshop will cover the following:
Attendees will get hands-on experience on how to use the Briefcase toolset to investigate de-embedding situations with real-world examples, using proposed solutions from IEEE 370.
Agenda:
This will be a live training held via Zoom. You will receive the link upon registration (contact ieee-sa-events@ieee.org with any questions).
