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Active & Intelligent Packaging World Congress and Hackathon
November 2nd - 3rd, 2017
| Amsterdam, The Netherlands
Register now and get money back
Register and share your registration on your Social Media channels.
When a colleague in your network used your shared code to register, you will get 10% refund and your colleague a 10% discount
Is that smart or not?
only valid if your pay by credit card
sharing links will be sent to you in the registration confirmation mail
The World Congress on Active & Intelligent Packaging is the most comprehensive global overview of the Active & Intelligent Packaging sector, covering the state-of-the-art from fighting food waste thru traceability / monitoring in the supply chain to anti-counterfeiting and, most importantly, consumer engagement with tags, sensors and printed electronics. With 36 speakers and two hackathons it is going to be great Brain Training!
So you’d better book today and come for your lessons!
Stefan De Troch
Director of Product Management
NXP Semiconductors Belgium NV
Senior Research Scientist
EVP Product & Business Development
Founder & CEO
Manager New Business Development
Henkel AG & Co. KGaA
Director Market Development - Intelligent Labels
Japan Food Packaging Association
Digital Transformation Senior Manager
Business Development Manager
Centre for Process Innovation Limited
Dr Shira Rosen
Packaging development manager
head of sales
Co-foundre and Managing Director
CEO and owner
Senior Project Manager
Prime Business Consulting Shanghai Co., Ltd.
Chair, Retail & Payment Working Group
VP Product Development
The Absolut Company
Sergio Seguí Romera
Business Development Manager of FRESHCODE
New Business Development Leader EMEA
Dow Europe GmbH
Global Marketing - Smart Consumer Products
KURZ Digital Solutions GmbH & Co. KG
SVP Marketing and Business Development
Chief Digital Officer
Manager, External Innovation
Global Technology Leader Cold-Chain Solutions
DuPont Protection Solutions
Business development Leader
Cambridge Design Partnership
Quentin van den Hove
Product Manager Security Software Solutions
Eef de Ferrante
Active & Intelligent Packaging Industry Association
Chief Business Development Officer
Linkz IM Ltd.
Nico Van de Walle
Product Innovation Manager
Product Development Manager
Founder + CEO
Dick De Koning
Food Safety Projects Manager
EUFIC - European Food Information Council
Intelligent packaging specialist
I Packaging Expertise
DIRECTOR ITENE Madrid
ITENE- Packaging Research Institute
Technion - Israel Institute of Technology
Strategy and Marketing, Digital Manufacturing
Senior Vice President and General Manager-Systech UniSecure
An example of who will attend. (Refresh page to see more)
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Amsterdam Conference Centre Beurs van Berlage,
Beurs van Berlage, Damrak, Amsterdam, Nederland